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Controlled Expansion Al-27%Si Alloy Cover Plate For Optoelectronic Application
With the rapid development of electronic technology,the properties of conventional packaging could not meet the marketing demand.Thus,Baienwei Co.,Ltd developed a series of binary silicon aluminum alloys for electronic and other applications,the main product is the Al-27%Si alloy which also called Osprey CE17 alloy in foreign countries,featuring proven low thermal expansion coefficients,higher heat conductivity,low density and thermo-mechanical stability,such as circuit board stiffener in electronic devices.Because the circuit board has the function of strengthening board of all the specifications and shapes.It is particularly significance in the defense,aerospace and other applications.
Baienwei Co.,Ltd has the competence to handle every aspect of manufacturing process from choosing the suitable material to machining the electronic components and right up to assist your testing. Possessing a highly motivated engineering team of specialists,we are in the position to optimally convert your requirements and assist in reducing your overall cost.We stick to the principle of ‘’Technological innovation and rejuvenate the state by industrialization’’.Our company is a versatile manufacturer of electronic and aerospace components for telecom system and communications applications.We serve our markets with both standard products and customized driven products and milling CNC machining service.Through years of great effort,significant progress has been made in the development of system level packages,automotive assembly parts and aerospace structure parts.In recent years,scientists and researchers are paying great attention to the development of silicon aluminum alloys.Tianjin Baienwei New Material Technology Co.,Ltd is an ISO 9001:2008 QMS and China National Military Standard(GJB) certificated silicon aluminum alloys manufacturer.Our heritage is to provide their national and international clientele with both standard products and customer driven special development products and services.Being a high-tech company,they continuously breakthrough and meticulously execute their existing products to serve the market.
The overall properties of Baienwei Co.,Ltd thermal management materials are superior to other alloys:
Baienwei's AlSi alloys | Material Properties | Other alloys |
Silicon particles are refined and distribute well,any part of the alloy material is consistent with an average grain size of 10μm,shows uniform and isostropic | Internal Microstructure | Exhibit bigger silicon particles with coarse and porous |
Silicon particles distribute well,no stoma and holes,improve the strength performance and product yield | Strength | Silicon particles more than 50μm,eminently reduce the strength |
Silicon content occupes by the weight of 27%~80%,adjusted CTE in the range of 7~17ppm/℃ is available,CTE can be tailored based on client 's requirements | CTE (Coefficient of thermal expansion) | Permanent CTE,single products could not satify the market's various demands |
High-efficiency process routing,enhance product yield and reduce the comprehensive cost | Embedded Cost | Decrease product yield,Higher production cost |
Good machinability-smooth machined surface | Machining Property | Non-uniform distribution of silicon particles,ease of edge-breaking and no metallic luster |
Baienwei's Al-Si alloys ensure compact density can reach up to 100%,close tightness and excellent welding performance | Welding Property | Easily crack when welding, reduction of product passing rate |
Using standard aluminum eletroless plating,good plating adhesion strength | Electro-plating Property | Ease of crack when welding,reduce the product qualification rate |
Baienwei ensures relative density of alloys is 100%,good hermetiic performance of chamber and keep the electronic components longevity | Hermetic Performance | Configuration has porous,do not reach 100% relative density resulting in poor cavity and reduce the performance of electronic components |