Electronic packaging refers to the integrated circuit chips which possess a specific function(comprises semiconductor integrated circuit chips,thin film integrated circuit chips and hybrid integrated circuit chips), built into an adaptable enclosure,in order to provide a reliability circumstances,consider protection the chips from exterior damaging to keep normal and stability performance.Packaging is important for signal and power transmission, heat dissipation, electromagnetic interference shielding and protection from environmental factors such as moisture, contamination, hostile chemicals and radiation.

The basic styles of electronic packaging,comprising the plastic capsulation,ceramic packaging,metal packaging and metal matrix composite material packaging,and etc.

In conventional process,copper-tungsten composite materials,bonding the advantages of metal tungsten and copper together,it not only has the low coefficient of thermal expansion(CTE) of tungsten,but also has the high thermal conductivity of copper.By adjusting the content of tungsten,  the coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics(Al2O3, BeO), Semiconductors(Si), and metals(Kovar), etc.Copper-tungsten materials possess the features of higher heat resistance and high thermal & electronic conductivity,mostly in the applications of large scale integrated circuit and high-power microwave devices as insulation metal base plate,thermal control panel，cooling device(heat sink material) and lead frame.

In contrast with the above traditional process,heat sinks are like any other product in the always-advancing field of computers. Companies are constantly striving to find lighter, more conductive materials to make efficient heat sinks. They don't need to be made from just one material. For example, our company heat sink is bonding silicon carbide and aluminum(for its lightweight properties)together. Both are composite materials made of SiC particles and metal, and are made by allowing metal to permeate into the gaps between SiC particles.AlSiC requires formed SiC before molten metal is infiltrated between the SiC particles. Having been processed as required, the formed SiC are placed into a mold, and high-pressure molten aluminum alloy is allowed to infiltrate. Following this, the structures are processed and plated to become products.With world-class facilities and supported by groups of engineers,we are your complete electronic packaging or housings partner.